Power chips are attached to outside circuits through packaging, and their efficiency depends upon the support of the packaging. In high-power circumstances, power chips...

Power chips are attached to outside circuits through packaging, and their efficiency depends upon the support of the packaging. In high-power circumstances, power chips are usually packaged as power modules. Chip affiliation describes the electrical connection on the top surface of the chip, which is normally light weight aluminum bonding cord in standard modules. ^ Typical power module bundle cross-section At present, industrial silicon carbide power components still mostly utilize the product packaging innovation of this wire-bonded traditional silicon IGBT component. They face issues such as large high-frequency parasitical criteria, insufficient heat dissipation capability, low-temperature resistance, and inadequate insulation toughness, which restrict using silicon carbide semiconductors. The display screen of excellent efficiency. In order to fix these...

Power chips are attached to outside circuits through packaging, and their efficiency depends upon the support of the packaging. In high-power circumstances, power chips are usually packaged as power modules. Chip affiliation describes the electrical connection on the top surface of the chip, which is normally light weight aluminum bonding cord in standard modules. ^ Typical power module bundle cross-section At present, industrial silicon carbide power components still mostly utilize the product packaging innovation of this wire-bonded traditional silicon IGBT component. They face issues such as large high-frequency parasitical criteria, insufficient heat dissipation capability, low-temperature resistance, and inadequate insulation toughness, which restrict using silicon carbide semiconductors. The display screen of excellent efficiency. In order to fix these...